Shanghai, June 12, 2025 — At its latest flagship technology summit, Infineon Technologies showcased a series of significant innovations across wide-bandgap materials and microcontroller technology, confirming its strong leadership in power and automotive semiconductors.
Breakthroughs in Power Semiconductor Materials
Infineon continues to set industry benchmarks across the three major semiconductor material platforms:
● In September 2024, the company introduced the world’s first 300 mm GaN-on-silicon power wafer, supporting scalable, high-efficiency systems.
● In October 2024, Infineon launched the thinnest silicon power wafer ever produced, targeting higher performance in compact designs.
● By February 2025, Infineon began delivering its first 200 mm SiC-based products, advancing high-voltage applications in electric vehicles, renewable energy, and industrial drives.
These developments reflect Infineon’s clear commitment to supporting sustainable electrification and system innovation.
Market Momentum: Leading Across Power and Automotive
Infineon maintains strong market positions across multiple segments:
● Global #1 in microcontroller units (MCUs), including both automotive and general-purpose MCUs.
● Top-ranked automotive semiconductor supplier for the fifth consecutive year.
● Undisputed leader in power semiconductors for 21 years running.
This long-term strength is supported by robust R&D investments—13% of FY2024 revenue was allocated to innovation—ensuring Infineon stays ahead in materials, packaging, and system solutions.
Focused Innovation Across Three Core Business Areas
Automotive Semiconductors
Infineon’s upcoming TC4x automotive MCU platform, based on a 28nm process, is optimized for next-generation EV control and zonal architectures. The company continues to expand its product portfolio across MCUs, power devices, sensors, and security solutions, enabling flexible architectures for global OEMs.
Industrial & Infrastructure
Infineon’s power devices are deployed in global wind and solar projects, rail infrastructure, and energy storage systems. Its SiC portfolio is central to decarbonization efforts, offering enhanced performance and efficiency. Production of low-power IGBT modules is also being localized to better meet system integration needs.
Computing & Communications
In response to the rising demand from AI data centers and robotics, Infineon offers system-level solutions to enhance power density and reduce energy consumption. The company also delivers end-to-end power and control components tailored for intelligent robots and edge AI platforms.
Futuretech Components: Delivering the Future of Power
